tiếng việt  česky  english 

Advanced search
Article notification Print Decrease font size Increase font size

Successful presentation of Czech companies producing agriculture and foodstuff technologies and products at the trade fair Vietstock 2014 in Ho Chi Minh City

(This article expired 28.10.2015.)

One dozen Czech companies participated in the trade fair Vietstock 2014 which focused in agri/foodstuff technologies and products. The event was organized by the Embassy of the Czech Republic in Hanoi as an economic diplomacy project in Saigon Exhibition and Convention Centre in Ho Chi Minh City from 15th till 17th October, 2014. The project included the Czech exhibition stand and special seminar “Czech Advanced Technologies and Products in Agriculture and Food Industry” which attracted about one hundred Vietnamese and foreign specialists.

During the fair, the Czech companies held more than 250 meetings. Czech companies with experience from Vietnamese market extended their present partnerships with local firms and newcomers in the territory got first offers for cooperation in trade, research, education and training or exchange of experience. Successful Czech mission to HCMC was supported by two social events. The first was organized by the Czech Embassy in cooperation with the Honorary Consul for Czech and Vietnamese businessmen and the second was prepared by Vietnam-Czech Friendship Association to commemorate the Czech Nation Day on 28th October.

Ambassador M. Klepetko framed his program in HCMC by a few other meetings. With the Chairman of People Committee of HCMC bilateral relations including topics in the fields of economy and education were discussed. With the Deputy Director of Military Hospital, participation of Czech companies in the reconstruction of the hospital was assessed and with the Director of Saigon Botanical Garden and Zoo, the Ambassador discussed future cooperation with Czech partners in the field of protection of endangered species.

 

 

 

 

 

 

 

Attachments

attachment

Vietstock8 370 KB DOC (Word document)